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 The 2nd International Pharmaceutical Ingredients Expo & Conference (API 2008) is an international trade fair for all kinds of ingredients specialized for pharmaceutical and cosmetics industry. It is concurrently held with 21st Interphex Japan, Asia’s largest pharmaceutical event, and 7th International Bio Forum & Bio Expo Japan, Asia’s largest bio event. With three events held together, API 2008 offers you the most effective business opportunities for the Japanese/Asian pharmaceutical ingredient market.

Since the amendment of the Pharmaceutical Affairs Law in 2004, pharmaceutical manufacturers have sought an effective ways to improve production costs and quality, as well as solutions to technical development. Under the circumstance, pharmaceutical manufacturers have been searching ways to form new roots into ingredient suppliers. With the growing needs for international event specialized in pharmaceutical ingredients, International Pharmaceutical Expo & Conference was finally launched last year, providing great opportunities for companies from worldwide to meet with ingredient suppliers face to face, ending in a huge success. For 2008, API expands its size dramatically to offer effective business opportunities for pharmaceutical industries in Japan/Asia.

This year, 1,400* exhibitors and 55,000* visitors will gather under one roof, providing an indispensable place for networking and business development for specialists in pharmaceutical industries. Compared to last year, the venue of API 2008 is categorized into six special exhibit zones, which enhance the efficiency for visitors for smooth business meetings. Below are the six zones;

In conclusion, API 2008 is an ideal place for business opportunities, information gathering, and for networking with industry specialists. API 2008 is highly expected as the annual gathering for industry specialists from worldwide.

More info: Ms. Kayo Nomura, 18F Shinjyuku-Nomura Bldg., 1-26-2 Nishishinjyuku, Shinjuku, Tokyo 163-0570, Japan. Tel: +81-3-3349-8509, Fax: +81-3-3349-4922. E-mail: api-pr@reedexpo.co.jp; Website: http://www.api-expo.jp/english/